DIP

Dual in-line package, or DIP, is a chip package with two rows of pins. It can be through-hole mounted or inserted in a socket. Common packages can have anywhere from 4 to 64 pins.

Other names: DIL, PDIP, SDIP, SPDIP, CDIP, CERDIP

0.1" Pitch, 0.3" Wide
The most common style of DIP packages, with a pitch of 0.1" (2.54 mm) and a row spacing of 0.3".

0.1" Pitch, 0.4" Wide
A pitch of 0.1" (2.54 mm) and a row spacing of 0.4".

0.1" Pitch, 0.6" Wide
A pitch of 0.1" (2.54 mm) and a row spacing of 0.6".

0.1" Pitch, 0.9" Wide
A pitch of 0.1" (2.54 mm) and a row spacing of 0.9".